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TIC 1000A

Features and Benefits:
• High thermal performance: 0.32° C/W (@ 50 psi)
• Good screenability
• Room temperature storage
• No post "cure" required
• Exceptional value
TIC 1000A is a high performance, thermally conductive compound intended for use as a thermal interface material between a high end computer processor and a heat sink. Other high watt density applications will also benefit from the extremely low thermal impedance of TIC 1000A.
TIC 1000A compound wets-out the thermal interface surfaces and flows to produce the lowest thermal impedance. The compound requires pressure of the assembly to cause flow. The TIC 1000A compound will resist dripping.
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