STRUCTALIT Adezivi structurali
- Adeziviii Structalit® sunt produse pe baza de rasini epoxidice monocomponente si bicomponente, cu rezistenta superioara, stabilitate termica si rezistenta chimica.
- Structalit® poate fi utilizat si in aplicatii speciale si de inalta tehnologie cum ar fi sigilarea componentelor electrice pana la aplicatii electronice de inalta tehnologie.
- Usor de folosit si rapid
- Produsele monocomponente se intaresc cu ajutorul caldurii
- Produsele bicomponente se intaresc la temperatura camerei
- Cost efficient
- Adezivii cu rasina epoxidica din seria Structalit® sunt alegerea perfecta pentru lipirea diferitelor subtraturi.
- Fiecare adeziv prezinta proprietati diferite, oferind o solutie de lipire perfecta pentru fiecare substrat si aplicatie. Adezivii Structalit® sunt potriviti pentru lipire:
- Metal, Sticla, Portelan, Ceramica, Piatra, Beton
- Fibra de sticla, PVC, Spuma rigida ( polistiren), Lemn, FR4
Pentru a descărca fișele tehnice (TDS), vă rugăm să faceți clic pe numele adezivului
| Adhesive |
Application | Viscosity [mPas] |
Base | Curing | Properties |
|---|---|---|---|---|---|
| Structalit® 701 | lens bonding cement optical cement medical technology |
3,000-5,000 | 2-part epoxy | thermal | Transparent in thin layers long potlife fast curing certified to USP Class VI and ISO 10993-5 standards |
| Structalit® 1028 R | general applications | 16,000-24,000 | 2-part-epoxy | room temperature | Versatile applications easily dispensable with double cartridge |
| Structalit® 3060-1 | Structural bonding Electronics: Die attach OPV photovoltaics |
7,000-10,000 Rheometer, 25 °C, 10^s-1 |
epoxy | thermal | non-conductive high flexibility very fast curing very low ion content high bond strength to several substrates |
| Structalit® 5511 | Wire protection Potting and sealing of temperature sensitive substrates |
800-1,200 | epoxy | thermal at 60°C | Non-conductive Outstanding adhesion to high performance plastics (LCP, PBT) High purity Electronic grade standard |
| Structalit® 5521 | Wire protection Potting and sealing of temperature sensitive substrates |
1,200-2,000 |
epoxy | thermal at 60°C | Non-conductive Outstanding adhesion to high performance plastics (LCP, PBT) High purity Electronic grade standard Flexible |
| Structalit® 5531 | Wire protection Potting and sealing of temperature sensitive substrates |
5,000-10,000 ( |
epoxy | thermal at 60°C | Non-conductive Outstanding adhesion to high performance plastics (LCP, PBT) High purity Electronic grade standard Good mechanical stability Good chemical resistance |
| Structalit® 5604 | attaching components on PCBs SMD assembly die attach smart card plastic bonding |
25,000-40,000 Rheometer, 25 °C, 10^s-1 |
epoxy | thermal | Fast curing red color fixing components on PCBs SMD applications |
| Structalit® 5606 F | PCBs and Electronics Attaching components and SMDs |
22 000 - 30 000 |
Epoxy | Thermal | 1part epoxy, fluorescing bluish Fast curing at low temperatures High shock resistance Short time resistant to soldering temperatures up to 270° C |
| Structalit® 5610 | attaching components on PCBs SMD assembly |
22,000-40,000 | epoxy | thermal | very fast curing even at low temperatures high temperature resistance red color |
| Structalit® 5704 | Frame-material for Frame&Fill Glob top Electrics Electronics |
60,000-100,000 Rheometer, 25 °C, 10^s-1 |
epoxy | thermal | black color stable frame suitable in combination with Structalit 5717-5721 no bleeding very low ion content (<10ppm) high glass transition temperature |
| Structalit® 5705 | Edge Bonding, Applications on PCBs |
7,000-12,000 | epoxy | thermal | Black color, yellow fluorescent, reworkable above 150°C, j ettable, low in halogens, very suitable as edge bonding adhesive |
| Structalit® 5717 | Fill-material for "Frame&Fill" Glob top Electrics Electronics |
3,000-8,000 Rheometer, 25 °C, 10^s-1 |
epoxy | thermal | Black color, very good flowability High glass transition temperature No bleeding Very low ionic content (<10ppm) Suitable for semiconductors |
| Structalit® 5719 | Fill-material for "Frame&Fill" Glob top Electrics Electronics |
7,000-11,000 |
epoxy | thermal | Very good flowability High glass transition temperature No bleeding Very low ionic content (<10ppm) Suitable for semiconductors |
| Structalit® 5720 | Fill-material for "Frame&Fill" Glob Top Electrics Electronics |
10,000-15,000 Rheometer, 25 °C, 10^s-1 |
epoxy | thermal | Very good flowability High glass transition temperature No bleeding Very low ionic content (<10ppm) suitable for semiconductors |
| Structalit® 5721 | Fill-material for "Frame&Fill" Glob top Electrics Electronics |
15,000-20,000 | epoxy | thermal | Very good flowability High glass transition temperature No bleeding Very low ionic content (<10ppm) Suitable for semiconductors |
| Structalit® 5751 | Underfill | 200-500 Rheometer, 25 °C, 10^s-1 |
epoxy | thermal | Black color, fluorescent yellow, jetable, low ion content, reworkable above 150°C |
| Structalit® 5791 | Frame-material for "Frame&Fill" Glob top Electrics Electronics |
45,000-65,000 | epoxy | thermal | black color excellent shock resistance low halogen content <900 ppm |
| Structalit® 5800 | encapsulation of electronic components potting material encapsulation of plastic parts plastic bonding automotive, aerospace |
7,000-15,000 mix LVT, 25°C, Sp. 4/30 rpm |
2-part epoxy | thermal, room temperature | High temperature resistance short pot life fast application |
| Structalit® 5801 | encapsulation of electronic components potting material encapsulation of plastic parts |
12,000-22,000 mix, 10,000-20,000 part A, 18,000-29,000 part B, Rheometer, 25 °C, 10s^-1 |
2-part epoxy | thermal, room temperature | Black color Excellent oil, chemical and moisture resistance Low shrinkage Low water absorption Good adhesion to metal, glass and plastics |
| Structalit® 5802 | encapsulation of electronic components potting material encapsulation of plastic parts plastic bonding automotive, aerospace |
40,000-65,000 mix Rheometer, 25 °C, 10^s-1 |
2-part epoxy | thermal, room temperature | Dark grey color Excellent oil, chemical and moisture resistance Low shrinkage Low water absorption Good adhesion to metal, glass and plastics Flame classification based on UL 94 HB |
| Structalit® 5803 | bonding and coating of metals and glass magnet bonding automotive |
100,000 mix Rheometer, 25 °C, 10^s-1 |
2-part epoxy | thermal, room temperature | Black color Good oil, chemical and moisture resistance Impact resistant Low water absorption Very good adhesion to metal Flame classification based on UL 94 HB |
| Structalit® 5810-1 | encapsulation of electronic components and plastic parts potting material plastic and glass bonding automotive, aerospace |
3,000-4,000 mix LVT, 25°C, Sp. 4/30 rpm |
2-part epoxy | thermal room temperature |
Very high adhesion to PC resistant to moisture and chemicals |
| Structalit® 5811 | Coating, potting material Bonding of metals, glass and many pastics |
Part A: 900-1,300, Part B: 100-350 |
2-part epoxy | thermal, room temperature | Very good adhesion to metals, glass and many plastics |
| Structalit® 5820 | potting material | 20,000-25,000 | epoxy | thermal | transparent high adhesion to metals |
| Structalit® 5830 | SMD assembly potting material automotive, aerospace |
28,000-38,000 LVT, 25°C, Sp. 4/6 rpm |
epoxy | thermal | Yellow color adheres well to metal impact resistant high peel strength |
| Structalit® 5858 | Automotive, E-Mobility Motor Assembly |
82,000-100,000 Rheometer, 25 °C, 10^s-1 |
epoxy | thermal | Opaque, white color, adheres well to metal, impact resistant, good elongation at break |
| Structalit® 5859 | Automotive, E-Mobility Motor Assembly |
82,000-100,000 Rheometer, 25 °C, 10^s-1 |
epoxy | thermal | Opaque, white color, adheres well to metal, impact resistant, good elongation at break |
| Structalit® 5891 | glob top encapsulation plastic bonding SMD assembly |
25,000-50,000 Rheometer, 25 °C, 10^s-1 |
epoxy | thermal | Black color fast curing at low temperatures impact resistant |
| Structalit® 5891 T | glob top encapsulation SMD assembly attaching components on PCBs |
80,000-150,000 Rheometer, 25 °C, 10s^-1 |
epoxy | thermal | Black color stable frame material, can be applied wet-in-wet with filling material, suitable for frame stacking stable edges resistant to shocks |
| Structalit® 5893 | glob top encapsulation SMD assembly medical technology needle bonding frame&fill |
6,000-10,000 Rheometer, 25°C, 10s^-1 |
epoxy | thermal | Black color excellent flow properties filling material for frame & fill applications high resistance to heat and chemicals certified to ISO 10993-5 standards |
| Structalit® 5894 M | glob top encapsulation encapsulation of electronic components SMD assembly automotive, aerospace potting material |
20,000-30,000 Rheometer, 25 °C, 10^s-1 |
epoxy | thermal | Black color excellent flow properties filling material for frame and fill applications on PCBs, very high resistance to heat and chemicals |
| Structalit® 8202 | Electronics Automotive Underfill for chip stack packages Protection of soldered connections |
300-400 Rheometer, 25 °C, 10^s-1 |
epoxy | thermal | Black, fast curing Capillary flow behavior Compatible with flux materials Low CTE, high glass transition temperature Low ion content (Cl- <900ppm) |
| Structalit® 8801 | attaching components on PCBs encapsulation of electronic components SMD assembly encapsulation of plastic parts potting material automotive, aerospace |
30,000-45,000 LVT, 25°C, Sp. 4/6 rpm |
epoxy | thermal | Resistant to oils, grease and fuels excellent flow properties beige color certified to ISO 10993-5 standards |
| Structalit® 8801 black | attaching components on PCBs encapsulation of electronic components SMD assembly encapsulation of plastic parts potting material automotive, aerospace |
30,000-45,000 | epoxy | thermal | Resistant to oils, grease and fuels black color excellent flow properties |
| Structalit® 8801 T | attaching components on PCBs encapsulation of electronic components SMD assembly encapsulation of plastic parts potting material automotive, aerospace |
16,000-30,000 |
epoxy | thermal | Resistant to oils, grease and fuels; Stable; Fast curing at low temperatures |
| Structalit® 8805 | attaching components on PCBs encapsulation of electronic components SMD assembly encapsulation of plastic parts potting material automotive, aerospace |
30,000-45,000 | epoxy | thermal | Resistant to oils, grease and fuels excellent flow properties beige color |
| Structalit® 8838 | attaching components on PCBs encapsulation of electronic components SMD assembly |
6,500-7,500 Rheometer, 25°C, 20s^-1 |
epoxy | thermal | Black color flexible potting compound excellent flow properties |